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Machines for grinding, brushing, polishing superfinishing and deburring LOESER GmbH 67346 Speyer Germany info Phone:+49 6232 31 480

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Grinding(brušenje) Grinding is an abrasive machining process that uses a grinding wheel as the cutting tool. A wide variety of machines are used for grinding:

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The majority of semiconductor devices are built on silicon wafers. Manufacturing of highquality silicon wafers involves several machining processes including grinding.

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